
APF19-19-10CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK LOW-PROFILE FORGED
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APF19-19-10CB
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK LOW-PROFILE FORGED
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | APF19-19-10CB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Fin Height [z] | 9.4 mm |
| Fin Height [z] | 0.37 " |
| Length | 0.748 in |
| Length | 19 mm |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC, BGA, LGA, CPU |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow | 5.3 °C/W, 200 LFM |
| Type | Top Mount |
| Width [y] | 0.748 in |
| Width [y] | 19 mm |
APF19 Series
| Part | Width [y] | Width [y] | Thermal Resistance @ Forced Air Flow | Shape | Type | Attachment Method | Package Cooled | Material | Material Finish | Fin Height [z] | Fin Height [z] | Length | Length | Fin Height [z] | Shelf Life |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components | 0.748 in | 19 mm | 5.3 °C/W 200 LFM | Fins Square | Top Mount | Thermal Tape Adhesive (Not Included) | ASIC BGA CPU LGA | Aluminum | Black Anodized | 9.4 mm | 0.37 " | 0.748 in | 19 mm | ||
Tusonix a Subsidiary of CTS Electronic Components | 0.748 in | 19 mm | 4 °C/W 200 LFM | Fins Square | Top Mount | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | Black Anodized | 12.7 mm | 0.748 in | 19 mm | 0.5 in | 24 Months | |
Tusonix a Subsidiary of CTS Electronic Components | 0.748 in | 19 mm | 5.3 °C/W 200 LFM | Fins Square | Top Mount | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | Black Anodized | 9.4 mm | 0.37 " | 0.748 in | 19 mm | 24 Months | |
Tusonix a Subsidiary of CTS Electronic Components | 0.748 in | 19 mm | 7.1 °C/W 200 LFM | Fins Square | Top Mount | Thermal Tape Adhesive (Not Included) | ASIC BGA CPU LGA | Aluminum | Black Anodized | 6.35 mm | 0.748 in | 19 mm | 0.25 in | ||
Tusonix a Subsidiary of CTS Electronic Components | 0.748 in | 19 mm | 7.1 °C/W 200 LFM | Fins Square | Top Mount | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | Black Anodized | 6.35 mm | 0.748 in | 19 mm | 0.25 in | 24 Months | |
Tusonix a Subsidiary of CTS Electronic Components | 0.748 in | 19 mm | 4 °C/W 200 LFM | Fins Square | Top Mount | Thermal Tape Adhesive (Not Included) | ASIC BGA CPU LGA | Aluminum | Black Anodized | 12.7 mm | 0.748 in | 19 mm | 0.5 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Box | 1 | $ 2.67 | |
| 10 | $ 2.60 | |||
| 25 | $ 2.53 | |||
| 50 | $ 2.48 | |||
Description
General part information
APF19 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources