NC191LTA50T5

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Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

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NC191LTA50T5

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Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	NC191LTA50T5

Composition [custom]	Bi57Sn42Ag1 (57/42/1)
Flux Type	No-Clean
Form	Jar
Form	1.76 oz
Form	50 g
Melting Point [custom]	137 °C
Melting Point [custom]	279 °F
Mesh Type	5
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Type	Solder Paste

NC191 Series

Part	Shelf Life	Form	Form	Form	Shelf Life Start	Type	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Flux Type	Melting Point [custom]	Melting Point [custom]	Mesh Type	Process	Mesh Type [custom]	Form	Shipping Info	Composition	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Composition [custom]	Form
Chip Quik Inc. NC191-2CC6	24 Months	Tube	2 g	0.07 oz 2 cc	Date of Manufacture	Flux - No Clean	37 °F	25 °C	3 °C	77 °F
Chip Quik Inc. NC191AX250T5	12 Months	Jar 8.8 oz (250g)			Date of Manufacture	Solder Paste					No-Clean	361 °F	183 °C	5	Leaded
Chip Quik Inc. NC191AX35	12 Months	Syringe	35 g	1.23 oz	Date of Manufacture	Solder Paste					No-Clean	361 °F	183 °C		Leaded	4	10 cc
Chip Quik Inc. NC191LT10	6 Months	Syringe	10 g	0.35 oz 5 ml	Date of Manufacture	Solder Paste					No-Clean	280 °F	138 °C			4		Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Chip Quik Inc. NC191SNL35	6 Months	Syringe	35 g	1.23 oz	Date of Manufacture	Solder Paste					No-Clean					4	10 cc		Sn96.5Ag3Cu0.5 (96.5/3/0.5)	428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191LTA50T5	12 Months	Jar	50 g		Date of Manufacture	Solder Paste					No-Clean	279 °F	137 °C	5										Bi57Sn42Ag1 (57/42/1)	1.76 oz
Chip Quik Inc. NC191LTA15T5	12 Months	Syringe	15 g	0.53 oz 5 ml	Date of Manufacture	Solder Paste					No-Clean	279 °F	137 °C	5										Bi57Sn42Ag1 (57/42/1)
Chip Quik Inc. NC191-30CC	24 Months	Syringe	30 g	1.06 oz 30 cc	Date of Manufacture	Flux - No Clean	37 °F	25 °C	3 °C	77 °F

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 27.95

Description

General part information

NC191 Series

No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 1.76 oz (50g)

Documents

Technical documentation and resources