NC191LT10

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Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

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NC191LT10

Active

Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	NC191LT10

Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Flux Type	No-Clean
Form	5 ml, 0.35 oz
Form	10 g
Form	Syringe
Melting Point [custom]	138 °C
Melting Point [custom]	280 °F
Mesh Type [custom]	4
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type	Solder Paste

NC191 Series

Part	Shelf Life	Form	Form	Form	Shelf Life Start	Type	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Flux Type	Melting Point [custom]	Melting Point [custom]	Mesh Type	Process	Mesh Type [custom]	Form	Shipping Info	Composition	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Composition [custom]	Form
Chip Quik Inc. NC191-2CC6	24 Months	Tube	2 g	0.07 oz 2 cc	Date of Manufacture	Flux - No Clean	37 °F	25 °C	3 °C	77 °F
Chip Quik Inc. NC191AX250T5	12 Months	Jar 8.8 oz (250g)			Date of Manufacture	Solder Paste					No-Clean	361 °F	183 °C	5	Leaded
Chip Quik Inc. NC191AX35	12 Months	Syringe	35 g	1.23 oz	Date of Manufacture	Solder Paste					No-Clean	361 °F	183 °C		Leaded	4	10 cc
Chip Quik Inc. NC191LT10	6 Months	Syringe	10 g	0.35 oz 5 ml	Date of Manufacture	Solder Paste					No-Clean	280 °F	138 °C			4		Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Chip Quik Inc. NC191SNL35	6 Months	Syringe	35 g	1.23 oz	Date of Manufacture	Solder Paste					No-Clean					4	10 cc		Sn96.5Ag3Cu0.5 (96.5/3/0.5)	428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191LTA50T5	12 Months	Jar	50 g		Date of Manufacture	Solder Paste					No-Clean	279 °F	137 °C	5										Bi57Sn42Ag1 (57/42/1)	1.76 oz
Chip Quik Inc. NC191LTA15T5	12 Months	Syringe	15 g	0.53 oz 5 ml	Date of Manufacture	Solder Paste					No-Clean	279 °F	137 °C	5										Bi57Sn42Ag1 (57/42/1)
Chip Quik Inc. NC191-30CC	24 Months	Syringe	30 g	1.06 oz 30 cc	Date of Manufacture	Flux - No Clean	37 °F	25 °C	3 °C	77 °F

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 7.95

Description

General part information

NC191 Series

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.35 oz (10g), 5cc

Documents

Technical documentation and resources