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SCS215AJTLL - SCS215AJTLL

SCS215AJTLL

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Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 15 A, 23 NC, TO-263AB

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SCS215AJTLL - SCS215AJTLL

SCS215AJTLL

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 15 A, 23 NC, TO-263AB

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Technical Specifications

Parameters and characteristics for this part

SpecificationSCS215AJTLL
Capacitance @ Vr, F550 pF
Current - Average Rectified (Io)15 A
Current - Reverse Leakage @ Vr300 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]175 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 6.43
10$ 5.51
100$ 4.59
500$ 4.05
Digi-Reel® 1$ 6.43
10$ 5.51
100$ 4.59
500$ 4.05
Tape & Reel (TR) 1000$ 2.89
NewarkEach 1$ 8.14
10$ 5.54
25$ 5.05
50$ 4.56
100$ 4.07
250$ 4.06
500$ 3.48

Description

General part information

SCS215AJ Series

Switching loss reduced, enabling high-speed switching . (3-pin package)

Documents

Technical documentation and resources

TO-263AB (LPTL) Taping Spec

Datasheet

SiC Flammability

Related Document

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

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How to measure the oscillation occurs between parallel-connected devices

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4 Steps for Successful Thermal Designing of Power Devices

White Paper

Diode Types and Applications

Technical Article

Reliability Test Result

Manufacturing Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

What Is Thermal Design

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Taping Information

Package Information

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation

Package Information

Package Dimensions

Package Information

Condition of Soldering

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Inner Structure

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Compliance of the ELV directive

Environmental Data

ESD Data

Characteristics Data

Explanation for Marking

Package Information

About Export Administration Regulations (EAR)

Export Information