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SCS215AEGC11 - Product dimension image

SCS215AEGC11

Active
Rohm Semiconductor

650V, 15A, 3-PIN THD, SILICON-CARBIDE (SIC) SBD

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SCS215AEGC11 - Product dimension image

SCS215AEGC11

Active
Rohm Semiconductor

650V, 15A, 3-PIN THD, SILICON-CARBIDE (SIC) SBD

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS215AEGC11
Capacitance @ Vr, F550 pF
Current - Average Rectified (Io)15 A
Current - Reverse Leakage @ Vr300 µA
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-247-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageTO-247
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.41
30$ 4.33
120$ 3.80
510$ 3.80

Description

General part information

SCS215AJ Series

Switching loss reduced, enabling high-speed switching . (3-pin package)

Documents

Technical documentation and resources

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Reliability Test Result

Manufacturing Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Create Symbols for PSpice Models

Models

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

ESD Data

Characteristics Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

SCS215AE Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

Diode Types and Applications

Technical Article

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Taping Information

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to measure the oscillation occurs between parallel-connected devices

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Compliance of the ELV directive

Environmental Data

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data