658-60AB

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Wakefield-Vette

HEATSINK CPU 28MM SQ BLK W/OTAPE

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Wakefield-Vette

HEATSINK CPU 28MM SQ BLK W/OTAPE

Technical Specifications

Parameters and characteristics for this part

Specification	658-60AB

Attachment Method	Thermal Tape, Adhesive (Not Included)
Fin Height	0.598 in
Fin Height	15.2 mm
Length [x]	27.94 mm
Length [x]	1.1 "
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	BGA
Power Dissipation @ Temperature Rise	2.5 W
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	2 °C/W
Type	Top Mount
Width [x]	1.1 "
Width [x]	27.94 mm

Part	Attachment Method	Thermal Resistance @ Forced Air Flow	Shape	Width [x]	Width [x]	Material	Type	Package Cooled	Material Finish	Length [x]	Length [x]	Fin Height	Fin Height	Power Dissipation @ Temperature Rise	Fin Height [z]	Fin Height [z]
Wakefield-Vette 658-60ABT3	Thermal Tape Adhesive (Included)	2 °C/W	Pin Fins Square	1.1 "	27.94 mm	Aluminum	Top Mount	BGA	Black Anodized	27.94 mm	1.1 "	0.598 in	15.2 mm	2.5 W
Wakefield-Vette 658-60AB	Thermal Tape Adhesive (Not Included)	2 °C/W	Pin Fins Square	1.1 "	27.94 mm	Aluminum	Top Mount	BGA	Black Anodized	27.94 mm	1.1 "	0.598 in	15.2 mm	2.5 W
Wakefield-Vette 658-60ABT6	Thermal Tape Adhesive (Not Included)	2 °C/W	Pin Fins Square	1.1 "	27.94 mm	Aluminum	Top Mount	BGA	Black Anodized	27.94 mm	1.1 "			2.5 W	15.24 mm	0.6 in
Wakefield-Vette 658-60ABT1E	Thermal Tape Adhesive (Included)	2 °C/W	Pin Fins Square	1.1 "	27.94 mm	Aluminum	Top Mount	BGA	Black Anodized	27.94 mm	1.1 "			2.5 W	15.24 mm	0.6 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink BGA Aluminum 2.5W @ 30°C Top Mount

Technical documentation and resources