HEATSINK CPU 28MM SQ BLK W/TAPE
| Part | Attachment Method | Thermal Resistance @ Forced Air Flow | Shape | Width [x] | Width [x] | Material | Type | Package Cooled | Material Finish | Length [x] | Length [x] | Fin Height | Fin Height | Power Dissipation @ Temperature Rise | Fin Height [z] | Fin Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | Thermal Tape Adhesive (Included) | 2 °C/W | Pin Fins Square | 1.1 " | 27.94 mm | Aluminum | Top Mount | BGA | Black Anodized | 27.94 mm | 1.1 " | 0.598 in | 15.2 mm | 2.5 W | ||
Wakefield-Vette | Thermal Tape Adhesive (Not Included) | 2 °C/W | Pin Fins Square | 1.1 " | 27.94 mm | Aluminum | Top Mount | BGA | Black Anodized | 27.94 mm | 1.1 " | 0.598 in | 15.2 mm | 2.5 W | ||
Wakefield-Vette | Thermal Tape Adhesive (Not Included) | 2 °C/W | Pin Fins Square | 1.1 " | 27.94 mm | Aluminum | Top Mount | BGA | Black Anodized | 27.94 mm | 1.1 " | 2.5 W | 15.24 mm | 0.6 in | ||
Wakefield-Vette | Thermal Tape Adhesive (Included) | 2 °C/W | Pin Fins Square | 1.1 " | 27.94 mm | Aluminum | Top Mount | BGA | Black Anodized | 27.94 mm | 1.1 " | 2.5 W | 15.24 mm | 0.6 in |