40-81250-610C

Active

Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Search across all available documentation for this part.

Active

Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	40-81250-610C

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame, Elevated
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Contact Material - Post [custom]	Mounting Type	Contact Finish - Mating	Termination	Contact Material - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Material Flammability Rating	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Housing Material	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Current Rating (Amps)
Aries Electronics 40-81250-610C	Brass	Through Hole	Gold	Solder	Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Gold	UL94 V-0	105 ░C	-55 °C	40	20	2	10 çin	0.25 çm	Closed Frame Elevated	Glass Filled Nylon 4/6 Polyamide (PA46)	3.56 mm	0.14 in	30 Áin	0.76 Ám	DIP	0.6 in	15.24 mm	3 A
Aries Electronics 40-81250-310C	Brass	Through Hole	Gold	Solder	Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Gold	UL94 V-0	105 ░C	-55 °C	40	20	2	10 çin	0.25 çm	Closed Frame Elevated	Glass Filled Nylon 4/6 Polyamide (PA46)	3.56 mm	0.14 in	30 Áin	0.76 Ám	DIP	0.3 "	7.62 mm	3 A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources