40-8125 Series

Catalog

40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Contact Material - Post [custom]	Mounting Type	Contact Finish - Mating	Termination	Contact Material - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Material Flammability Rating	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Housing Material	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Current Rating (Amps)
Aries Electronics 40-81250-610C	Brass	Through Hole	Gold	Solder	Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Gold	UL94 V-0	105 ░C	-55 °C	40	20	2	10 çin	0.25 çm	Closed Frame Elevated	Glass Filled Nylon 4/6 Polyamide (PA46)	3.56 mm	0.14 in	30 Áin	0.76 Ám	DIP	0.6 in	15.24 mm	3 A
Aries Electronics 40-81250-310C	Brass	Through Hole	Gold	Solder	Beryllium Copper	2.54 mm	0.1 in	0.1 in	2.54 mm	Gold	UL94 V-0	105 ░C	-55 °C	40	20	2	10 çin	0.25 çm	Closed Frame Elevated	Glass Filled Nylon 4/6 Polyamide (PA46)	3.56 mm	0.14 in	30 Áin	0.76 Ám	DIP	0.3 "	7.62 mm	3 A