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W66CQ2NQUAGJ - 200WFBGA

W66CQ2NQUAGJ

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Winbond Electronics

DRAM CHIP MOBILE LPDDR4X SDRAM 4GBIT 128MX32 1.1V/1.8V 200-PIN WFBGA

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W66CQ2NQUAGJ - 200WFBGA

W66CQ2NQUAGJ

Active
Winbond Electronics

DRAM CHIP MOBILE LPDDR4X SDRAM 4GBIT 128MX32 1.1V/1.8V 200-PIN WFBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationW66CQ2NQUAGJ
Clock Frequency1866 MHz
Memory FormatDRAM
Memory Organization128 M
Memory Size512 kb
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]105 °C
Operating Temperature [Min]-40 °C
Package / Case200-WFBGA
Supplier Device Package200-WFBGA (10x14.5)
TechnologySDRAM - Mobile LPDDR4X
Voltage - Supply [Max]1.95 V, 1.17 V
Voltage - Supply [Min]1.06 V, 1.7 V
Write Cycle Time - Word, Page18 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 144$ 6.28

Description

General part information

W66CQ2 Series

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.866 GHz 3.5 ns 200-WFBGA (10x14.5)