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42-6556-20

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Aries Electronics

CONN IC DIP SOCKET 42POS GOLD

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42-6556-20

Active
Aries Electronics

CONN IC DIP SOCKET 42POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification42-6556-20
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)42
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length7.19 mm
Termination Post Length0.283 in
TypeDIP
Type0.6 in
Type15.24 mm

42-6556 Series

PartContact Finish - PostMounting TypeContact Material - Post [custom]FeaturesContact Finish Thickness - PostContact Finish Thickness - PostPitch - PostPitch - PostNumber of Positions or Pins (Grid)TypeTypeTypeMaterial Flammability RatingContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - MatingPitch - MatingTermination Post LengthTermination Post LengthCurrent Rating (Amps)Housing MaterialContact Material - MatingContact Finish - MatingTermination
Aries Electronics
Tin
Through Hole
Brass
Open Frame
200 µin
5.08 µm
2.54 mm
0.1 in
42
DIP
0.6 in
15.24 mm
UL94 V-0
30 Áin
0.76 Ám
0.1 in
2.54 mm
0.18 in
4.57 mm
3 A
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
Gold
Aries Electronics
Gold
Through Hole
Brass
Open Frame
10 çin
0.25 çm
2.54 mm
0.1 in
42
DIP
0.6 in
15.24 mm
UL94 V-0
30 Áin
0.76 Ám
0.1 in
2.54 mm
0.13 in
3.3 mm
3 A
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
Gold
Solder
Aries Electronics
Gold
Through Hole
Brass
Open Frame
10 çin
0.25 çm
2.54 mm
0.1 in
42
DIP
0.6 in
15.24 mm
UL94 V-0
30 Áin
0.76 Ám
0.1 in
2.54 mm
0.283 in
7.19 mm
3 A
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
Gold
Wire Wrap
Aries Electronics
Gold
Through Hole
Brass
Open Frame
10 çin
0.25 çm
2.54 mm
0.1 in
42
DIP
0.6 in
15.24 mm
UL94 V-0
30 Áin
0.76 Ám
0.1 in
2.54 mm
0.18 in
4.57 mm
3 A
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
Gold
Aries Electronics
Tin
Through Hole
Brass
Open Frame
200 µin
5.08 µm
2.54 mm
0.1 in
42
DIP
0.6 in
15.24 mm
UL94 V-0
30 Áin
0.76 Ám
0.1 in
2.54 mm
0.423 in
10.74 mm
3 A
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
Gold
Wire Wrap
Aries Electronics
Tin
Through Hole
Brass
Open Frame
200 µin
5.08 µm
2.54 mm
0.1 in
42
DIP
0.6 in
15.24 mm
UL94 V-0
30 Áin
0.76 Ám
0.1 in
2.54 mm
0.283 in
7.19 mm
3 A
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
Gold
Wire Wrap

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 25$ 15.80

Description

General part information

42-6556 Series

42 (2 x 21) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources