42-6556 Series

Catalog

CONN IC DIP SOCKET 42POS GOLD

Part	Contact Finish - Post	Mounting Type	Contact Material - Post [custom]	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Type	Type	Type	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Housing Material	Contact Material - Mating	Contact Finish - Mating	Termination
Aries Electronics 42-6556-40	Tin	Through Hole	Brass	Open Frame	200 µin	5.08 µm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.18 in	4.57 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold
Aries Electronics 42-6556-11	Gold	Through Hole	Brass	Open Frame	10 çin	0.25 çm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.13 in	3.3 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Solder
Aries Electronics 42-6556-21	Gold	Through Hole	Brass	Open Frame	10 çin	0.25 çm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.283 in	7.19 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Wire Wrap
Aries Electronics 42-6556-41	Gold	Through Hole	Brass	Open Frame	10 çin	0.25 çm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.18 in	4.57 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold
Aries Electronics 42-6556-30	Tin	Through Hole	Brass	Open Frame	200 µin	5.08 µm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.423 in	10.74 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Wire Wrap
Aries Electronics 42-6556-20	Tin	Through Hole	Brass	Open Frame	200 µin	5.08 µm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.283 in	7.19 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Wire Wrap