Zenode.ai Logo
Beta
⌘K
Log InSign Up
SCS205KGC17 - Product dimension image

SCS205KGC17

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 1.2 KV, 5 A, 17 NC, TO-220ACG

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsCutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICsHow to Create Symbols for PSpice Models+30
SCS205KGC17 - Product dimension image

SCS205KGC17

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 1.2 KV, 5 A, 17 NC, TO-220ACG

Deep-Dive with AI

DocumentsCutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICsHow to Create Symbols for PSpice Models+30

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS205KGC17
Capacitance @ Vr, F270 pF
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr100 µA
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-220-2
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageTO-220ACFP
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]1.2 kV
Voltage - Forward (Vf) (Max) @ If1.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 6.60
50$ 3.52
100$ 3.22
500$ 2.70
1000$ 2.63
NewarkEach 1$ 4.87
10$ 4.21
25$ 3.69
50$ 3.46
100$ 3.00
250$ 2.52
500$ 2.43

Description

General part information

SCS205KG Series

Switching loss reduced, enabling high-speed switching . (2-pin package)

Documents

Technical documentation and resources

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to Create Symbols for PSpice Models

Models

Diode Types and Applications

Technical Article

500V DC-DC Forward Converter: Reference Circuit

Reference Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

About Flammability of Materials

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation

Package Information

Compliance of the ELV directive

Environmental Data

ESD Data

Characteristics Data

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

About Export Administration Regulations (EAR)

Export Information

DC-DC Quasi-Resonant Converter: Reference Circuit

Reference Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

SCS205KG Data Sheet

Data Sheet

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Technical Data Sheet EN

Datasheet