211-1-08-003

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CnC Tech, LLC

CONN IC DIP SOCKET 8POS GOLD

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211-1-08-003

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CnC Tech, LLC

CONN IC DIP SOCKET 8POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	211-1-08-003

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	4 mOhm
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polybutylene Terephthalate (PBT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	0.3 "
Type	7.62 mm
Type	DIP

211-1 Series

Part	Termination	Housing Material	Pitch - Post	Pitch - Post	Material Flammability Rating	Operating Temperature [Max]	Operating Temperature [Min]	Features	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Material - Post [custom]	Contact Finish - Mating	Contact Resistance	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
CnC Tech, LLC 211-1-06-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole	2	6	3	0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm
CnC Tech, LLC 211-1-20-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	20
CnC Tech, LLC 211-1-32-006	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.6 in	15.24 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm		2 x 16	32
CnC Tech, LLC 211-1-18-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	18
CnC Tech, LLC 211-1-08-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	8
CnC Tech, LLC 211-1-14-003	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole				0.3 "	7.62 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	14
CnC Tech, LLC 211-1-40-006	Solder	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	UL94 V-0	105 ░C	-55 °C	Open Frame	Tin	10 çin	0.25 çm	0.11 in	2.78 mm	Beryllium Copper	Through Hole	2		20	0.6 in	15.24 mm	DIP	200 µin	5.08 µm	3 A	Brass	Gold	4 mOhm	0.1 in	2.54 mm	40

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 0.85
		10	$ 0.72
		25	$ 0.69
		50	$ 0.67
		100	$ 0.64
		250	$ 0.59
		500	$ 0.53
		1000	$ 0.47
		2500	$ 0.42

Description

General part information

211-1 Series

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources