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211-1-32-006 - 211-1-32-006

211-1-32-006

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CnC Tech, LLC

CONN IC DIP SOCKET 32POS GOLD

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211-1-32-006 - 211-1-32-006

211-1-32-006

Active
CnC Tech, LLC

CONN IC DIP SOCKET 32POS GOLD

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Technical Specifications

Parameters and characteristics for this part

Specification211-1-32-006
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Contact Resistance4 mOhm
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialPolybutylene Terephthalate (PBT)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]2 x 16
Number of Positions or Pins (Grid) [custom]32
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.11 in
Termination Post Length2.78 mm
TypeDIP
Type0.6 in
Type15.24 mm

211-1 Series

PartTerminationHousing MaterialPitch - PostPitch - PostMaterial Flammability RatingOperating Temperature [Max]Operating Temperature [Min]FeaturesContact Finish - PostContact Finish Thickness - MatingContact Finish Thickness - MatingTermination Post LengthTermination Post LengthContact Material - MatingMounting TypeNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]TypeTypeTypeContact Finish Thickness - PostContact Finish Thickness - PostCurrent Rating (Amps)Contact Material - Post [custom]Contact Finish - MatingContact ResistancePitch - MatingPitch - MatingNumber of Positions or Pins (Grid)Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
2
6
3
0.3 "
7.62 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
0.3 "
7.62 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
20
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
0.6 in
15.24 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
2 x 16
32
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
0.3 "
7.62 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
18
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
0.3 "
7.62 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
8
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
0.3 "
7.62 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
14
CnC Tech, LLC
Solder
Polybutylene Terephthalate (PBT)
2.54 mm
0.1 in
UL94 V-0
105 ░C
-55 °C
Open Frame
Tin
10 çin
0.25 çm
0.11 in
2.78 mm
Beryllium Copper
Through Hole
2
20
0.6 in
15.24 mm
DIP
200 µin
5.08 µm
3 A
Brass
Gold
4 mOhm
0.1 in
2.54 mm
40

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 2.26
10$ 1.97
25$ 1.89
50$ 1.84

Description

General part information

211-1 Series

32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources