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SCS304AJTLL - LPTL

SCS304AJTLL

NRND
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 4 A, 11 NC, TO-263AB

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SCS304AJTLL - LPTL

SCS304AJTLL

NRND
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 650 V, 4 A, 11 NC, TO-263AB

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS304AJTLL
Capacitance @ Vr, F200 pF
Current - Average Rectified (Io)4 A
Current - Reverse Leakage @ Vr20 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]175 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.12
10$ 1.78
100$ 1.44
500$ 1.41
Digi-Reel® 1$ 2.12
10$ 1.78
100$ 1.44
500$ 1.41
Tape & Reel (TR) 1000$ 1.41
NewarkEach 1$ 2.20
10$ 2.18
25$ 1.94
50$ 1.71
100$ 1.51

Description

General part information

SCS304AJ Series

Low forward voltage, negligible recovery time/current. Suitable for switch mode power supply, uninterruptible power supply, solar inverter, etc.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Condition of Soldering

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

SCS304AJ Data Sheet

Data Sheet

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Diode Types and Applications

Technical Article

How to Create Symbols for PSpice Models

Models

About Export Administration Regulations (EAR)

Export Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Anti-Whisker formation

Package Information

Package Dimensions

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the ELV directive

Environmental Data