573300D00000G

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Boyd Laconia, LLC

TOP MOUNT HEATSINK .4" D2PAK

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Boyd Laconia, LLC

TOP MOUNT HEATSINK .4" D2PAK

Technical Specifications

Parameters and characteristics for this part

Specification	573300D00000G

Attachment Method	SMD Pad
Fin Height	0.4 "
Fin Height	10.16 mm
Length	0.5 in
Length	12.7 mm
Material	Aluminum
Material Finish	Tin
Package Cooled [custom]	TO-263
Package Cooled [custom]	D²Pak
Power Dissipation @ Temperature Rise	1.3 W
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	8 °C/W, 300 LFM
Thermal Resistance @ Natural	18 °C/W
Type	Top Mount
Width	26.16 mm
Width [x]	1.03 in

Part	Shape	Thermal Resistance @ Natural	Length	Length	Material	Width	Width [x]	Power Dissipation @ Temperature Rise	Type	Attachment Method	Material Finish	Fin Height	Fin Height	Thermal Resistance @ Forced Air Flow	Package Cooled [custom]	Package Cooled [custom]
Boyd Laconia, LLC 573300D00000G	Rectangular Fins	18 °C/W	0.5 in	12.7 mm	Aluminum	26.16 mm	1.03 in	1.3 W	Top Mount	SMD Pad	Tin	0.4 "	10.16 mm	8 °C/W 300 LFM	TO-263	D²Pak

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink TO-263 (D²Pak) Aluminum 1.3W @ 30°C Top Mount

Technical documentation and resources