Beta
⌘K
TOP MOUNT HEATSINK .4" D2PAK
| Part | Shape | Thermal Resistance @ Natural | Length | Length | Material | Width | Width [x] | Power Dissipation @ Temperature Rise | Type | Attachment Method | Material Finish | Fin Height | Fin Height | Thermal Resistance @ Forced Air Flow | Package Cooled [custom] | Package Cooled [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | Rectangular Fins | 18 °C/W | 0.5 in | 12.7 mm | Aluminum | 26.16 mm | 1.03 in | 1.3 W | Top Mount | SMD Pad | Tin | 0.4 " | 10.16 mm | 8 °C/W 300 LFM | TO-263 | D²Pak |