W25N512GVEIG

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Winbond Electronics

IC FLASH 512MBIT SPI/QUAD 8WSON

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Winbond Electronics

IC FLASH 512MBIT SPI/QUAD 8WSON

Technical Specifications

Parameters and characteristics for this part

Part	Access Time	Memory Interface	Clock Frequency	Voltage - Supply [Max]	Voltage - Supply [Min]	Memory Format	Memory Organization	Memory Type	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Write Cycle Time - Word, Page	Technology	Package / Case	Mounting Type	Package / Case [x]	Package / Case [y]
Winbond Electronics W25N512GWPIR TR	7 ns	SPI - Quad I/O	104 MHz	1.95 V	1.7 V	FLASH	64 M	Non-Volatile	8-WSON (6x5)	85 °C	-40 °C	64 MB	700 µs	FLASH - NAND (SLC)	8-WDFN Exposed Pad	Surface Mount
Winbond Electronics W25N512GWFIR	7 ns	SPI - Quad I/O	104 MHz	1.95 V	1.7 V	FLASH	64 M	Non-Volatile	16-SOIC	85 °C	-40 °C	64 MB	700 µs	FLASH - NAND (SLC)	16-SOIC	Surface Mount	0.295 in	7.5 mm
Winbond Electronics W25N512GVEIG		SPI - Quad I/O	166 MHz	3.6 V	2.7 V	FLASH	64 M	Non-Volatile	8-WSON (8x6)	85 °C	-40 °C	64 MB	700 µs	FLASH - NAND (SLC)	8-WDFN Exposed Pad	Surface Mount
Winbond Electronics W25N512GVEIG TR	6 ns	SPI - Quad I/O	166 MHz	3.6 V	2.7 V	FLASH	64 M	Non-Volatile	8-WSON (8x6)	85 °C	-40 °C	64 MB	700 µs	FLASH - NAND (SLC)	8-WDFN Exposed Pad	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

FLASH - NAND (SLC) Memory IC 512Mbit SPI - Quad I/O 166 MHz 8-WSON (8x6)

Technical documentation and resources