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IC FLASH 512MBIT SPI/QUAD 8WSON
| Part | Access Time | Memory Interface | Clock Frequency | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Format | Memory Organization | Memory Type | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Write Cycle Time - Word, Page | Technology | Package / Case | Mounting Type | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 7 ns | SPI - Quad I/O | 104 MHz | 1.95 V | 1.7 V | FLASH | 64 M | Non-Volatile | 8-WSON (6x5) | 85 °C | -40 °C | 64 MB | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Surface Mount | ||
Winbond Electronics | 7 ns | SPI - Quad I/O | 104 MHz | 1.95 V | 1.7 V | FLASH | 64 M | Non-Volatile | 16-SOIC | 85 °C | -40 °C | 64 MB | 700 µs | FLASH - NAND (SLC) | 16-SOIC | Surface Mount | 0.295 in | 7.5 mm |
Winbond Electronics | SPI - Quad I/O | 166 MHz | 3.6 V | 2.7 V | FLASH | 64 M | Non-Volatile | 8-WSON (8x6) | 85 °C | -40 °C | 64 MB | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Surface Mount | |||
Winbond Electronics | 6 ns | SPI - Quad I/O | 166 MHz | 3.6 V | 2.7 V | FLASH | 64 M | Non-Volatile | 8-WSON (8x6) | 85 °C | -40 °C | 64 MB | 700 µs | FLASH - NAND (SLC) | 8-WDFN Exposed Pad | Surface Mount |