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44-3575-11

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Aries Electronics

CONN IC DIP SOCKET ZIF 44POS TIN

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44-3575-11

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 44POS TIN

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification44-3575-11
Contact Finish - PostTin
Contact Finish Thickness - Mating5.08 µm
Contact Finish Thickness - Mating200 µin
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)44 Positions or Pins
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.11 in
Termination Post Length2.78 mm
Type7.62 mm
Type0.3 in
TypeDIP, ZIF (ZIP)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 12$ 35.24

Description

General part information

44-3575 Series

44 (2 x 22) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

Documents

Technical documentation and resources