44-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Housing Material	Termination Post Length	Termination Post Length	Mounting Type	Contact Material - Post	Pitch - Post	Pitch - Post	Features	Current Rating (Amps)	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Type	Type	Type	Material Flammability Rating
Aries Electronics 44-3575-10	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Closed Frame	1 A	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 in	2.54 mm	44 Positions or Pins	200 µin	5.08 µm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0
Aries Electronics 44-3575-16	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Closed Frame	1 A	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 in	2.54 mm	44 Positions or Pins	200 µin	5.08 µm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0
Aries Electronics 44-3575-11	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Closed Frame	1 A	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 in	2.54 mm	44 Positions or Pins	200 µin	5.08 µm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0
Aries Electronics 44-3575-18	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Closed Frame	1 A	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 in	2.54 mm	44 Positions or Pins	200 µin	5.08 µm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	UL94 V-0