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BDN09-3CB/A01 - BDN09-3CB/A01 Heat Sink

BDN09-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE .91"SQ

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BDN09-3CB/A01 - BDN09-3CB/A01 Heat Sink

BDN09-3CB/A01

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE .91"SQ

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationBDN09-3CB/A01
Attachment MethodThermal Tape, Adhesive (Included)
Fin Height9.02 mm
Fin Height0.355 in
Length [x]23.11 mm
Length [x]0.91 in
MaterialAluminum
Material FinishBlack Anodized
Package CooledASIC, BGA, LGA, CPU
ShapeSquare, Pin Fins
Shelf Life24 Months
Thermal Resistance @ Forced Air Flow9.6 °C/W
Thermal Resistance @ Natural26.9 °C/W
TypeTop Mount
Width [y]23.11 mm
Width [y]0.91 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBox 1$ 3.14
10$ 2.78
25$ 2.64
50$ 2.55
100$ 2.46
250$ 2.34
500$ 2.26
1232$ 2.15

Description

General part information

BDN09 Series

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Documents

Technical documentation and resources