HEATSINK CPU W/ADHESIVE .91"SQ
| Part | Fin Height | Fin Height | Shelf Life | Thermal Resistance @ Natural | Material Finish | Material | Package Cooled | Length [x] | Length [x] | Width [y] | Width [y] | Attachment Method | Thermal Resistance @ Forced Air Flow | Shape | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components | 9.02 mm | 0.355 in | 24 Months | 26.9 °C/W | Black Anodized | Aluminum | ASIC BGA CPU LGA | 23.11 mm | 0.91 in | 23.11 mm | 0.91 in | Thermal Tape Adhesive (Included) | 9.6 °C/W | Pin Fins Square | Top Mount |
Tusonix a Subsidiary of CTS Electronic Components | 9.02 mm | 0.355 in | 26.9 °C/W | Black Anodized | Aluminum | ASIC BGA CPU LGA | 23.11 mm | 0.91 in | 23.11 mm | 0.91 in | Thermal Tape Adhesive (Not Included) | 9.6 °C/W | Pin Fins Square | Top Mount |