7130DG

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

Technical Specifications

Parameters and characteristics for this part

Specification	7130DG

Attachment Method	Clip, PC Pin
Length	26.04 mm
Length	1.025 "
Material	Copper
Material Finish	Tin
Package Cooled	TO-218
Power Dissipation @ Temperature Rise	20 °C, 0.5 W
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	500 LFM, 4 °C/W
Thermal Resistance @ Natural	23.1 °C/W
Type	Board Level, Vertical
Width [x]	1.005 in
Width [x]	25.53 mm

Part	Material	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Package Cooled	Thermal Resistance @ Natural	Attachment Method	Width [x]	Width [x]	Shape	Type	Length	Length	Material Finish
Boyd Laconia, LLC 7130DG	Copper	0.5 W 20 °C	4 °C/W 500 LFM	TO-218	23.1 °C/W	Clip PC Pin	1.005 in	25.53 mm	Rectangular Fins	Board Level Vertical	26.04 mm	1.025 "	Tin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1000	$ 5.62

General part information

Heat Sink TO-218 Copper 0.5W @ 20°C Board Level, Vertical

Technical documentation and resources