Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Material | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Package Cooled | Thermal Resistance @ Natural | Attachment Method | Width [x] | Width [x] | Shape | Type | Length | Length | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | Copper | 0.5 W 20 °C | 4 °C/W 500 LFM | TO-218 | 23.1 °C/W | Clip PC Pin | 1.005 in | 25.53 mm | Rectangular Fins | Board Level Vertical | 26.04 mm | 1.025 " | Tin |