HSE-B18254-060H-W

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CUI Devices

HEATSINK: EXTRUDED; H; TO218; BLACK; L: 25.4MM; W: 41.6MM; H: 25MM

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CUI Devices

HEATSINK: EXTRUDED; H; TO218; BLACK; L: 25.4MM; W: 41.6MM; H: 25MM

Technical Specifications

Parameters and characteristics for this part

Specification	HSE-B18254-060H-W

Attachment Method	PC Pin, Bolt On
Fin Height	0.984 in
Fin Height	25 mm
Length [x]	1 in
Length [x]	25.4 mm
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	TO-218
Power Dissipation @ Temperature Rise	8.1 W, 75 °C
Shape	Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow	200 LFM, 3.09 °C/W
Type	Board Level, Vertical
Width [x]	1.638 in
Width [x]	41.6 mm

Part	Thermal Resistance @ Forced Air Flow	Attachment Method	Shape	Material Finish	Type	Fin Height	Fin Height	Width [x]	Width [x]	Power Dissipation @ Temperature Rise	Length [x]	Length [x]	Package Cooled	Material
CUI Devices HSE-B18254-060H-W	3.09 °C/W 200 LFM	Bolt On PC Pin	Rectangular Angled Fins	Black Anodized	Board Level Vertical	0.984 in	25 mm	1.638 in	41.6 mm	8.1 W 75 °C	1 in	25.4 mm	TO-218	Aluminum Alloy
CUI Devices HSE-B18254-035H	3.09 °C/W 200 LFM	Bolt On PC Pin	Rectangular Angled Fins	Black Anodized	Board Level Vertical	0.984 in	25 mm	1.638 in	41.6 mm	8.1 W 75 °C	1 in	25.4 mm	TO-218	Aluminum Alloy

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1500	$ 1.39

General part information

Heat Sink TO-218 Aluminum Alloy 8.1W @ 75°C Board Level, Vertical

Technical documentation and resources