XR2T-2021-N
ActiveOmron Electronics Inc-EMC Div
CONN IC DIP SOCKET 20POS GOLD
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XR2T-2021-N
ActiveOmron Electronics Inc-EMC Div
CONN IC DIP SOCKET 20POS GOLD
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | XR2T-2021-N |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | Flash |
| Contact Finish Thickness - Post | Flash |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Contact Resistance | 20 mOhm |
| Current Rating (Amps) | 1 A |
| Features | Seal Tape, Open Frame |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 20 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length [x] | 0.138 in |
| Termination Post Length [x] | 3.5 mm |
| Type | 0.3 " |
| Type | 7.62 mm |
| Type | DIP |
XR2T Series
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Termination Post Length [x] | Termination Post Length [x] | Type | Type | Type | Contact Material - Post [custom] | Material Flammability Rating | Mounting Type | Pitch - Post | Pitch - Post | Termination | Housing Material | Pitch - Mating | Pitch - Mating | Features | Current Rating (Amps) | Contact Material - Mating | Contact Resistance | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div | 10 çin | 0.25 çm | 24 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.4 in | 10.16 mm | DIP | Brass | UL94 V-0 | Threaded | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame | 1 A | Beryllium Copper | 20 mOhm | Gold | 10 çin | 0.25 çm | ||||
Omron Electronics Inc-EMC Div | 20 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Through Hole | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame Seal Tape | 1 A | Beryllium Copper | 20 mOhm | Gold | Flash | Flash | Beryllium Copper | ||||||
Omron Electronics Inc-EMC Div | 24 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.4 in | 10.16 mm | DIP | Brass | UL94 V-0 | Threaded | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame | 1 A | Beryllium Copper | 20 mOhm | Gold | Flash | Flash | ||||||
Omron Electronics Inc-EMC Div | 29.5 Áin | 0.75 Ám | 24 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.4 in | 10.16 mm | DIP | Brass | UL94 V-0 | Threaded | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame | 1 A | Beryllium Copper | 20 mOhm | Gold | 0.75 µm | 29.5 µin |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 24 | $ 5.05 | |
Description
General part information
XR2T Series
20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources