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CONN IC DIP SOCKET 24POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Termination Post Length [x] | Termination Post Length [x] | Type | Type | Type | Contact Material - Post [custom] | Material Flammability Rating | Mounting Type | Pitch - Post | Pitch - Post | Termination | Housing Material | Pitch - Mating | Pitch - Mating | Features | Current Rating (Amps) | Contact Material - Mating | Contact Resistance | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div | 10 çin | 0.25 çm | 24 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.4 in | 10.16 mm | DIP | Brass | UL94 V-0 | Threaded | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame | 1 A | Beryllium Copper | 20 mOhm | Gold | 10 çin | 0.25 çm | ||||
Omron Electronics Inc-EMC Div | 20 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Through Hole | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame Seal Tape | 1 A | Beryllium Copper | 20 mOhm | Gold | Flash | Flash | Beryllium Copper | ||||||
Omron Electronics Inc-EMC Div | 24 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.4 in | 10.16 mm | DIP | Brass | UL94 V-0 | Threaded | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame | 1 A | Beryllium Copper | 20 mOhm | Gold | Flash | Flash | ||||||
Omron Electronics Inc-EMC Div | 29.5 Áin | 0.75 Ám | 24 | Gold | -55 °C | 125 °C | 0.138 in | 3.5 mm | 0.4 in | 10.16 mm | DIP | Brass | UL94 V-0 | Threaded | 2.54 mm | 0.1 in | Solder | Polybutylene Terephthalate (PBT) Glass Filled | 0.1 in | 2.54 mm | Open Frame | 1 A | Beryllium Copper | 20 mOhm | Gold | 0.75 µm | 29.5 µin |