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SCT2450KEHRC11 - Product dimension image

SCT2450KEHRC11

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 10 A, 1.2 KV, 0.45 OHM, TO-247N

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsTwo-Resistor Model for Thermal SimulationExample of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials+42
SCT2450KEHRC11 - Product dimension image

SCT2450KEHRC11

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 10 A, 1.2 KV, 0.45 OHM, TO-247N

Deep-Dive with AI

DocumentsTwo-Resistor Model for Thermal SimulationExample of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials+42

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT2450KEHRC11
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)1200 V
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs27 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds463 pF
Mounting TypeThrough Hole
Operating Temperature175 °C
Package / CaseTO-247-3
Power Dissipation (Max) [Max]85 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs585 mOhm
Supplier Device PackageTO-247N
Vgs (Max) [Max]22 V
Vgs (Max) [Min]-6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 13.61
10$ 9.53
450$ 6.82
NewarkEach 1$ 12.52
10$ 9.34
25$ 9.31
50$ 9.28
100$ 9.25
250$ 7.73
900$ 7.72

Description

General part information

SCT2450KEHR Series

This is SiC (Silicon Carbide) planar MOSFET. This product have high voltage resistance, low ON resistance, and fast switching speed features. AEC-Q101 qualified automotive grade product.

Documents

Technical documentation and resources

Two-Resistor Model for Thermal Simulation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Compliance of the ELV directive

Environmental Data

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use PLECS Models

Technical Article

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

SCT2450KEHR Data Sheet

Data Sheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Taping Information

Package Information

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Anti-Whisker formation

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Package Dimensions

Package Information

Types and Features of Transistors

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

About Export Administration Regulations (EAR)

Export Information

SiC MOSFET Layout Design Considerations

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Technical Data Sheet EN

Datasheet