W25M512JVEIM

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Winbond Electronics

IC FLASH 512MBIT SPI/QUAD 8WSON

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Winbond Electronics

IC FLASH 512MBIT SPI/QUAD 8WSON

Technical Specifications

Parameters and characteristics for this part

Part	Supplier Device Package	Package / Case	Clock Frequency	Memory Type	Technology	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]	Memory Size	Memory Interface	Memory Organization	Mounting Type	Access Time	Write Cycle Time - Word, Page	Package / Case [x]	Package / Case [y]
Winbond Electronics W25M512JVBIQ TR	24-TFBGA (6x8)	24-TBGA	104 MHz	Non-Volatile	FLASH - NOR	2.7 V	3.6 V	FLASH	85 °C	-40 °C	64 MB	SPI	64 M	Surface Mount
Winbond Electronics W25M512JWCIQ	24-TFBGA (6x8)	24-TBGA	104 MHz	Non-Volatile	FLASH - NOR	1.7 V	1.95 V	FLASH	85 °C	-40 °C	64 MB	SPI	64 M	Surface Mount	7 ns	5 ms
Winbond Electronics W25M512JVCIQ TR	24-TFBGA (6x8)	24-TBGA	104 MHz	Non-Volatile	FLASH - NOR	2.7 V	3.6 V	FLASH	85 °C	-40 °C	64 MB	SPI	64 M	Surface Mount
Winbond Electronics W25M512JVEIM	8-WSON (8x6)	8-WDFN Exposed Pad	104 MHz	Non-Volatile	FLASH - NOR	2.7 V	3.6 V	FLASH	85 °C	-40 °C	64 MB	SPI - Quad I/O	64 M	Surface Mount	7 ns	3 ms
Winbond Electronics W25M512JVFIQ	16-SOIC	16-SOIC	104 MHz	Non-Volatile	FLASH - NOR	2.7 V	3.6 V	FLASH	85 °C	-40 °C	64 MB	SPI	64 M	Surface Mount			0.295 in	7.5 mm
Winbond Electronics W25M512JVFIQ TR	16-SOIC	16-SOIC	104 MHz	Non-Volatile	FLASH - NOR	2.7 V	3.6 V	FLASH	85 °C	-40 °C	64 MB	SPI	64 M	Surface Mount			0.295 in	7.5 mm
Winbond Electronics W25M512JWBIQ	24-TFBGA (6x8)	24-TBGA	104 MHz	Non-Volatile	FLASH - NOR	1.7 V	1.95 V	FLASH	85 °C	-40 °C	64 MB	SPI	64 M	Surface Mount	7 ns	5 ms

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$