IC FLASH 512MBIT SPI 24TFBGA
| Part | Supplier Device Package | Package / Case | Clock Frequency | Memory Type | Technology | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Memory Interface | Memory Organization | Mounting Type | Access Time | Write Cycle Time - Word, Page | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 24-TFBGA (6x8) | 24-TBGA | 104 MHz | Non-Volatile | FLASH - NOR | 2.7 V | 3.6 V | FLASH | 85 °C | -40 °C | 64 MB | SPI | 64 M | Surface Mount | ||||
Winbond Electronics | 24-TFBGA (6x8) | 24-TBGA | 104 MHz | Non-Volatile | FLASH - NOR | 1.7 V | 1.95 V | FLASH | 85 °C | -40 °C | 64 MB | SPI | 64 M | Surface Mount | 7 ns | 5 ms | ||
Winbond Electronics | 24-TFBGA (6x8) | 24-TBGA | 104 MHz | Non-Volatile | FLASH - NOR | 2.7 V | 3.6 V | FLASH | 85 °C | -40 °C | 64 MB | SPI | 64 M | Surface Mount | ||||
Winbond Electronics | 8-WSON (8x6) | 8-WDFN Exposed Pad | 104 MHz | Non-Volatile | FLASH - NOR | 2.7 V | 3.6 V | FLASH | 85 °C | -40 °C | 64 MB | SPI - Quad I/O | 64 M | Surface Mount | 7 ns | 3 ms | ||
Winbond Electronics | 16-SOIC | 16-SOIC | 104 MHz | Non-Volatile | FLASH - NOR | 2.7 V | 3.6 V | FLASH | 85 °C | -40 °C | 64 MB | SPI | 64 M | Surface Mount | 0.295 in | 7.5 mm | ||
Winbond Electronics | 16-SOIC | 16-SOIC | 104 MHz | Non-Volatile | FLASH - NOR | 2.7 V | 3.6 V | FLASH | 85 °C | -40 °C | 64 MB | SPI | 64 M | Surface Mount | 0.295 in | 7.5 mm | ||
Winbond Electronics | 24-TFBGA (6x8) | 24-TBGA | 104 MHz | Non-Volatile | FLASH - NOR | 1.7 V | 1.95 V | FLASH | 85 °C | -40 °C | 64 MB | SPI | 64 M | Surface Mount | 7 ns | 5 ms |