200-6325-9UN-1900

Obsolete

3M (TC)

CONN SOCKET PGA ZIF 625POS GOLD

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200-6325-9UN-1900

Obsolete

3M (TC)

CONN SOCKET PGA ZIF 625POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	200-6325-9UN-1900

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Housing Material	Polyethersulfone (PES)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	625
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.3 mm
Termination Post Length	0.13 in
Type	ZIF (ZIP), PGA

200 Series

Part	Contact Material - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Mounting Type	Material Flammability Rating	Number of Positions or Pins (Grid)	Current Rating (Amps)	Contact Finish - Post	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Accessory Type	For Use With/Related Products	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
3M (TC) 200-6319-9UN-1900	Beryllium Copper	3.3 mm	0.13 in	30 Áin	0.76 Ám	Solder	Through Hole	UL94 V-0	361	1 A	Gold	Polyethersulfone (PES)	-55 °C	150 °C	0.1 in	2.54 mm	Gold	PGA ZIF (ZIP)	Beryllium Copper	30 µin	0.76 µm	2.54 mm	0.1 in
3M (TC) 200-6313-9UN-1900	Beryllium Copper	3.3 mm	0.13 in	30 Áin	0.76 Ám	Solder	Through Hole	UL94 V-0	169	1 A	Gold	Polyethersulfone (PES)	-55 °C	150 °C	0.1 in	2.54 mm	Gold	PGA ZIF (ZIP)	Beryllium Copper	30 µin	0.76 µm	2.54 mm	0.1 in
3M (TC) 200-6325-9UN-1900	Beryllium Copper	3.3 mm	0.13 in	30 Áin	0.76 Ám	Solder	Through Hole	UL94 V-0	625	1 A	Gold	Polyethersulfone (PES)	-55 °C	150 °C	0.1 in	2.54 mm	Gold	PGA ZIF (ZIP)	Beryllium Copper	30 µin	0.76 µm	2.54 mm	0.1 in
3M (TC) 200-4660-14-1900								UL94 V-0					-55 °C	150 °C										Plug	3M™ PGA Sockets
3M (TC) 200-6317-9UN-1900	Beryllium Copper	3.3 mm	0.13 in	30 Áin	0.76 Ám	Solder	Through Hole	UL94 V-0		1 A	Gold	Polyethersulfone (PES)	-55 °C	150 °C	0.1 in	2.54 mm	Gold	PGA ZIF (ZIP)	Beryllium Copper	30 µin	0.76 µm	2.54 mm	0.1 in			17	289	17
3M (TC) 200-6311-9UN-1900	Beryllium Copper	3.3 mm	0.13 in	30 Áin	0.76 Ám	Solder	Through Hole	UL94 V-0	121	1 A	Gold	Polyethersulfone (PES)	-55 °C	150 °C	0.1 in	2.54 mm	Gold	PGA ZIF (ZIP)	Beryllium Copper	30 µin	0.76 µm	2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

200 Series

625 (25 x 25) Pos PGA, ZIF (ZIP) Socket Gold Through Hole

Documents

Technical documentation and resources