BM23PF0.8-46DS-0.35V(51)

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Hirose Electric USA, Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS 46P RCPT STRGHT SMT HYBRID W/POWER

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BM23PF0.8-46DS-0.35V(51)

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Hirose Electric USA, Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS 46P RCPT STRGHT SMT HYBRID W/POWER

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BM23PF0.8-46DS-0.35V(51)

Connector Type	Receptacle, Center Strip Contacts
Contact Finish	Gold
Contact Finish Thickness	1.97 Áin
Contact Finish Thickness	0.05 Ám
Features	Solder Retention
Height Above Board [z]	0.8 mm
Height Above Board [z]	0.031 in
Mated Stacking Heights	0.8 mm
Mounting Type	Surface Mount
Number of Positions	46
Number of Rows	2
Pitch [x]	0.35 mm
Pitch [x]	0.014 in

BM23PF0.8 Series

Part	Features	Mounting Type	Height Above Board [z]	Height Above Board [z]	Mated Stacking Heights	Connector Type	Contact Finish Thickness	Contact Finish Thickness	Number of Rows	Number of Positions	Contact Finish	Pitch [x]	Pitch [x]	Height Above Board	Height Above Board
Hirose Electric USA, Inc. BM23PF0.8-30DS-0.35V(895)	Solder Retention	Surface Mount	0.8 mm	0.031 in	0.8 mm	Center Strip Contacts Receptacle	1.97 Áin	0.05 Ám	2	30	Gold	0.35 mm	0.014 in
Hirose Electric USA, Inc. BM23PF0.8-14DP-0.35V(895)	Solder Retention	Surface Mount			0.8 mm	Header Outer Shroud Contacts	1.97 Áin	0.05 Ám	2	14	Gold	0.35 mm	0.014 in	0.63 mm	0.025 in
Hirose Electric USA, Inc. BM23PF0.8-40DP-0.35V(51)	Solder Retention	Surface Mount			0.8 mm	Header Outer Shroud Contacts	1.97 Áin	0.05 Ám	2	40	Gold	0.35 mm	0.014 in	0.63 mm	0.025 in
Hirose Electric USA, Inc. BM23PF0.8-24DS-0.35V(895)	Solder Retention	Surface Mount	0.8 mm	0.031 in	0.8 mm	Center Strip Contacts Receptacle	1.97 Áin	0.05 Ám	2	24	Gold	0.35 mm	0.014 in
Hirose Electric USA, Inc. BM23PF0.8-30DP-0.35V(895)	Solder Retention	Surface Mount			0.8 mm	Header Outer Shroud Contacts	1.97 Áin	0.05 Ám	2	30	Gold	0.35 mm	0.014 in	0.63 mm	0.025 in
Hirose Electric USA, Inc. BM23PF0.8-46DS-0.35V(51)	Solder Retention	Surface Mount	0.8 mm	0.031 in	0.8 mm	Center Strip Contacts Receptacle	1.97 Áin	0.05 Ám	2	46	Gold	0.35 mm	0.014 in
Hirose Electric USA, Inc. BM23PF0.8-20DS-0.35V(51)	Solder Retention	Surface Mount	0.8 mm	0.031 in	0.8 mm	Center Strip Contacts Receptacle	1.97 Áin	0.05 Ám	2	20	Gold	0.35 mm	0.014 in
Hirose Electric USA, Inc. BM23PF0.8-42DS-0.35V(51)	Solder Retention	Surface Mount	0.8 mm	0.031 in	0.8 mm	Center Strip Contacts Receptacle	1.97 Áin	0.05 Ám	2	42	Gold	0.35 mm	0.014 in
Hirose Electric USA, Inc. BM23PF0.8-46DP-0.35V(51)	Solder Retention	Surface Mount			0.8 mm	Header Outer Shroud Contacts	1.97 Áin	0.05 Ám	2	46	Gold	0.35 mm	0.014 in	0.63 mm	0.025 in
Hirose Electric USA, Inc. BM23PF0.8-24DP-0.35V(895)	Solder Retention	Surface Mount			0.8 mm	Header Outer Shroud Contacts	1.97 Áin	0.05 Ám	2	24	Gold	0.35 mm	0.014 in	0.63 mm	0.025 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	10000	$ 0.56

Description

General part information

BM23PF0.8 Series

46 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold

Documents

Technical documentation and resources