44-3553-11

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Aries Electronics

44P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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44-3553-11

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Aries Electronics

44P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	44-3553-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	44 Positions or Pins
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

44-3553 Series

Part	Termination	Termination Post Length	Termination Post Length	Contact Material - Post	Pitch - Mating	Pitch - Mating	Mounting Type	Material Flammability Rating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Type	Type	Type	Contact Finish - Post	Features	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3553-16	Solder	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	UL94 V-0	Nickel Boron	44 Positions or Pins	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	1.27 µm	50 µin	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron	Closed Frame	1 A
Aries Electronics 44-3553-11	Solder	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	UL94 V-0	Gold	44 Positions or Pins	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled					Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Gold	Closed Frame	1 A
Aries Electronics 44-3553-18	Solder	0.11 in	2.78 mm	Beryllium Nickel	0.1 in	2.54 mm	Through Hole	UL94 V-0	Nickel Boron	44 Positions or Pins	2.54 mm	0.1 in	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	1.27 µm	50 µin	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron	Closed Frame	1 A	-55 °C	250 °C
Aries Electronics 44-3553-10	Solder	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	UL94 V-0		44 Positions or Pins	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	5.08 µm	200 µin	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Tin	Closed Frame	1 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	21	$ 27.26
LCSC	Piece	1	$ 66.23
		203	$ 26.42
		497	$ 25.54
		1001	$ 25.11

Description

General part information

44-3553 Series

44 (2 x 22) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources