44-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Termination	Termination Post Length	Termination Post Length	Contact Material - Post	Pitch - Mating	Pitch - Mating	Mounting Type	Material Flammability Rating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Type	Type	Type	Contact Finish - Post	Features	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3553-16	Solder	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	UL94 V-0	Nickel Boron	44 Positions or Pins	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	1.27 µm	50 µin	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron	Closed Frame	1 A
Aries Electronics 44-3553-11	Solder	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	UL94 V-0	Gold	44 Positions or Pins	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled					Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Gold	Closed Frame	1 A
Aries Electronics 44-3553-18	Solder	0.11 in	2.78 mm	Beryllium Nickel	0.1 in	2.54 mm	Through Hole	UL94 V-0	Nickel Boron	44 Positions or Pins	2.54 mm	0.1 in	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	1.27 µm	50 µin	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron	Closed Frame	1 A	-55 °C	250 °C
Aries Electronics 44-3553-10	Solder	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Through Hole	UL94 V-0		44 Positions or Pins	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	5.08 µm	200 µin	Beryllium Copper	7.62 mm	0.3 in	DIP ZIF (ZIP)	Tin	Closed Frame	1 A