40-C182-30
ActiveAries Electronics
40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM IC / TRANSISTOR SOCKET ROHS
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40-C182-30
ActiveAries Electronics
40P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM IC / TRANSISTOR SOCKET ROHS
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Technical Specifications
Parameters and characteristics for this part
| Specification | 40-C182-30 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Closed Frame |
| Housing Material | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 40 |
| Number of Positions or Pins (Grid) [custom] | 20 |
| Number of Positions or Pins (Grid) [custom] | 2 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.04 in |
| Termination Post Length | 1.02 mm |
| Type | DIP |
| Type | 0.6 in |
| Type | 15.24 mm |
40-C182 Series
| Part | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Termination | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Features | Mounting Type | Type | Type | Type | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Gold | 3 A | 105 ░C | -55 °C | Beryllium Copper | Solder | 40 | 20 | 2 | Brass | Closed Frame | Through Hole | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Tin |
Aries Electronics | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Gold | 3 A | 125 °C | -55 °C | Beryllium Copper | Solder | 40 | 20 | 2 | Brass | Closed Frame | Through Hole | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Gold |
Aries Electronics | 2.54 mm | 0.1 in | 1.02 mm | 0.04 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Gold | 3 A | 105 ░C | -55 °C | Beryllium Copper | Solder | 40 | 20 | 2 | Brass | Closed Frame | Surface Mount | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Tin |
Aries Electronics | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Gold | 3 A | 125 °C | -55 °C | Beryllium Copper | Solder | 40 | 20 | 2 | Brass | Closed Frame | Through Hole | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Gold |
Aries Electronics | 2.54 mm | 0.1 in | 1.02 mm | 0.04 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Gold | 3 A | 105 ░C | -55 °C | Beryllium Copper | Solder | 40 | 20 | 2 | Brass | Closed Frame | Surface Mount | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Tin |
Aries Electronics | 2.54 mm | 0.1 in | 1.02 mm | 0.04 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Gold | 3 A | 125 °C | -55 °C | Beryllium Copper | Solder | 40 | 20 | 2 | Brass | Closed Frame | Surface Mount | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Gold |
Aries Electronics | 2.54 mm | 0.1 in | 1.02 mm | 0.04 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Gold | 3 A | 105 ░C | -55 °C | Beryllium Copper | Wire Wrap | 40 | 20 | 2 | Brass | Closed Frame | Through Hole | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 10 çin | 0.25 çm | Tin |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
40-C182 Series
40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
Documents
Technical documentation and resources