40-C182 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Mating	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Features	Mounting Type	Type	Type	Type	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post
Aries Electronics 40-C182-10	2.54 mm	0.1 in	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	3 A	105 ░C	-55 °C	Beryllium Copper	Solder	40	20	2	Brass	Closed Frame	Through Hole	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Tin
Aries Electronics 40-C182-11	2.54 mm	0.1 in	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	0.1 in	2.54 mm	Gold	3 A	125 °C	-55 °C	Beryllium Copper	Solder	40	20	2	Brass	Closed Frame	Through Hole	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Gold
Aries Electronics 40-C182-30	2.54 mm	0.1 in	1.02 mm	0.04 in	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	3 A	105 ░C	-55 °C	Beryllium Copper	Solder	40	20	2	Brass	Closed Frame	Surface Mount	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Tin
Aries Electronics 40-C182-11H	2.54 mm	0.1 in	3.18 mm	0.125 in	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	0.1 in	2.54 mm	Gold	3 A	125 °C	-55 °C	Beryllium Copper	Solder	40	20	2	Brass	Closed Frame	Through Hole	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Gold
Aries Electronics 40-C182-20	2.54 mm	0.1 in	1.02 mm	0.04 in	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	3 A	105 ░C	-55 °C	Beryllium Copper	Solder	40	20	2	Brass	Closed Frame	Surface Mount	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Tin
Aries Electronics 40-C182-21	2.54 mm	0.1 in	1.02 mm	0.04 in	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	0.1 in	2.54 mm	Gold	3 A	125 °C	-55 °C	Beryllium Copper	Solder	40	20	2	Brass	Closed Frame	Surface Mount	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Gold
Aries Electronics 40-C182-00	2.54 mm	0.1 in	1.02 mm	0.04 in	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	0.1 in	2.54 mm	Gold	3 A	105 ░C	-55 °C	Beryllium Copper	Wire Wrap	40	20	2	Brass	Closed Frame	Through Hole	DIP	0.6 in	15.24 mm	UL94 V-0	10 çin	0.25 çm	Tin