242-1281-09-0602J

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3M (TC)

IC & COMPONENT SOCKET, 42 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER

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242-1281-09-0602J

Active

3M (TC)

IC & COMPONENT SOCKET, 42 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	242-1281-09-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Convert From (Adapter End)	15.24 mm
Convert From (Adapter End)	DIP
Convert From (Adapter End)	0.6 in
Convert To (Adapter End)	0.6 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	15.24 mm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Pins	42
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.3 mm
Termination Post Length	0.13 in

242 Series

Part	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Termination Post Length	Termination Post Length	Mounting Type	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Number of Pins	Contact Finish - Post	Housing Material	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Material Flammability Rating	Termination	Contact Resistance	Type	Type	Type	Number of Positions or Pins (Grid)
3M (TC) 242-1293-29-0602J	0.07 in	1.78 mm	Gold	0.07 in	1.78 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	Through Hole	15.24 mm	DIP	0.6 in	1 A	30 Áin	0.76 Ám	Closed Frame	42	Gold	Polysulfone (PSU) Glass Filled	0.6 in	DIP	15.24 mm	UL94 V-0	Solder
3M (TC) 242-1293-00-0602J	0.07 in	1.78 mm	Gold	0.1 in	2.54 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	Connector				1 A	30 Áin	0.76 Ám	Closed Frame		Gold	Polysulfone (PSU) Glass Filled				UL94 V-0	Press-Fit	15 mOhm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42
3M (TC) 242-1281-09-0602J	0.1 in	2.54 mm	Gold	0.1 in	2.54 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	Through Hole	15.24 mm	DIP	0.6 in	1 A	30 Áin	0.76 Ám	Closed Frame	42	Gold	Polysulfone (PSU) Glass Filled	0.6 in	DIP	15.24 mm	UL94 V-0	Solder
3M (TC) 242-1289-00-0602J	0.1 in	2.54 mm	Gold	0.1 in	2.54 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	Connector				1 A	30 Áin	0.76 Ám	Closed Frame		Gold	Polysulfone (PSU) Glass Filled				UL94 V-0	Press-Fit	15 mOhm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

242 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole