242 Series

Manufacturer: 3M (TC)

Catalog

RECEPTACLE DIP SOCKET 42POS .6"

Part	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Termination Post Length	Termination Post Length	Mounting Type	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Number of Pins	Contact Finish - Post	Housing Material	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Material Flammability Rating	Termination	Contact Resistance	Type	Type	Type	Number of Positions or Pins (Grid)
3M (TC) 242-1293-29-0602J	0.07 in	1.78 mm	Gold	0.07 in	1.78 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	Through Hole	15.24 mm	DIP	0.6 in	1 A	30 Áin	0.76 Ám	Closed Frame	42	Gold	Polysulfone (PSU) Glass Filled	0.6 in	DIP	15.24 mm	UL94 V-0	Solder
3M (TC) 242-1293-00-0602J	0.07 in	1.78 mm	Gold	0.1 in	2.54 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	Connector				1 A	30 Áin	0.76 Ám	Closed Frame		Gold	Polysulfone (PSU) Glass Filled				UL94 V-0	Press-Fit	15 mOhm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42
3M (TC) 242-1281-09-0602J	0.1 in	2.54 mm	Gold	0.1 in	2.54 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	3.3 mm	0.13 in	Through Hole	15.24 mm	DIP	0.6 in	1 A	30 Áin	0.76 Ám	Closed Frame	42	Gold	Polysulfone (PSU) Glass Filled	0.6 in	DIP	15.24 mm	UL94 V-0	Solder
3M (TC) 242-1289-00-0602J	0.1 in	2.54 mm	Gold	0.1 in	2.54 mm	Beryllium Copper	-55 °C	125 °C	30 µin	0.76 µm	Beryllium Copper	2.78 mm	0.11 in	Connector				1 A	30 Áin	0.76 Ám	Closed Frame		Gold	Polysulfone (PSU) Glass Filled				UL94 V-0	Press-Fit	15 mOhm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42