
UPD70F3375M2GCA1-UEU-QS-AX
ObsoleteRenesas Electronics Corporation
IC MCU 32BIT 256KB FLSH 100LQFP
Deep-Dive with AI
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UPD70F3375M2GCA1-UEU-QS-AX
ObsoleteRenesas Electronics Corporation
IC MCU 32BIT 256KB FLSH 100LQFP
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | UPD70F3375M2GCA1-UEU-QS-AX |
|---|---|
| Connectivity | EBI/EMI, CANbus, UART/USART, LINbus, I2C, CSI |
| Core Processor | V850ES |
| Core Size | 32-Bit |
| Data Converters | 10 b, 16 |
| Data Converters | A/D, SAR |
| EEPROM Size | 32 K |
| Mounting Type | Surface Mount |
| Number of I/O | 84 I/O |
| Operating Temperature [Max] | 110 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 100-LQFP |
| Peripherals | DMA, LVD, PWM, POR, WDT |
| Program Memory Size | 256 KB |
| Program Memory Type | FLASH |
| RAM Size | 16 K |
| Speed | 32 MHz |
| Supplier Device Package | 100-LFQFP (14x14) |
| Voltage - Supply (Vcc/Vdd) [Max] | 5.5 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 3.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
V850ES/Fx3 Series
The V850ES/Fx3 is supported only for customers who have already adopted these products. The RH850/F1L or RH850/F1H Group is recommended for new designs.
Documents
Technical documentation and resources
No documents available