222-3343-19-0602J

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3M (TC)

RECEPTACLE DIP SOCKET 22POS .4"

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3M (TC)

RECEPTACLE DIP SOCKET 22POS .4"

Technical Specifications

Parameters and characteristics for this part

Specification	222-3343-19-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Convert To (Adapter End)	0.4 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	10.16 mm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Pins	22
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length [x]	0.62 in
Termination Post Length [x]	15.75 mm

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Material - Post	Material Flammability Rating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Termination	Contact Finish - Post	Current Rating (Amps)	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Number of Pins	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Termination Post Length [x]	Termination Post Length [x]
3M (TC) 222-3343-00-0602J	30 Áin	0.76 Ám	Closed Frame	Beryllium Copper	UL94 V-0	Gold	30 µin	0.76 µm	DIP ZIF ZIP	10.16 mm	0.4 in	Press-Fit	Gold	1 A	Polysulfone (PSU) Glass Filled	-55 °C	125 °C	22	0.11 in	2.78 mm	2.54 mm	0.1 in	Connector	0.1 in	2.54 mm	Beryllium Copper
3M (TC) 222-3343-09-0602J	30 Áin	0.76 Ám	Closed Frame	Beryllium Copper	UL94 V-0	Gold	30 µin	0.76 µm				Solder	Gold	1 A	Polysulfone (PSU) Glass Filled	-55 °C	125 °C		0.13 in	3.3 mm	2.54 mm	0.1 in	Through Hole	0.1 in	2.54 mm	Beryllium Copper	22	0.4 in	DIP	10.16 mm
3M (TC) 222-3343-19-0602J	30 Áin	0.76 Ám	Closed Frame	Beryllium Copper	UL94 V-0	Gold	30 µin	0.76 µm				Wire Wrap	Gold	1 A	Polysulfone (PSU) Glass Filled	-55 °C	125 °C				2.54 mm	0.1 in	Through Hole	0.1 in	2.54 mm	Beryllium Copper	22	0.4 in	DIP	10.16 mm	0.62 in	15.75 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole

Technical documentation and resources