Beta
⌘K
IC & COMPONENT SOCKET, 22 CONTACTS, DIP SOCKET, 2.54 MM, 222 SERIES, 10.16 MM, BERYLLIUM COPPER
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Material - Post | Material Flammability Rating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Termination | Contact Finish - Post | Current Rating (Amps) | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Number of Pins | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Termination Post Length [x] | Termination Post Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | 30 Áin | 0.76 Ám | Closed Frame | Beryllium Copper | UL94 V-0 | Gold | 30 µin | 0.76 µm | DIP ZIF ZIP | 10.16 mm | 0.4 in | Press-Fit | Gold | 1 A | Polysulfone (PSU) Glass Filled | -55 °C | 125 °C | 22 | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Connector | 0.1 in | 2.54 mm | Beryllium Copper | ||||||
3M (TC) | 30 Áin | 0.76 Ám | Closed Frame | Beryllium Copper | UL94 V-0 | Gold | 30 µin | 0.76 µm | Solder | Gold | 1 A | Polysulfone (PSU) Glass Filled | -55 °C | 125 °C | 0.13 in | 3.3 mm | 2.54 mm | 0.1 in | Through Hole | 0.1 in | 2.54 mm | Beryllium Copper | 22 | 0.4 in | DIP | 10.16 mm | ||||||
3M (TC) | 30 Áin | 0.76 Ám | Closed Frame | Beryllium Copper | UL94 V-0 | Gold | 30 µin | 0.76 µm | Wire Wrap | Gold | 1 A | Polysulfone (PSU) Glass Filled | -55 °C | 125 °C | 2.54 mm | 0.1 in | Through Hole | 0.1 in | 2.54 mm | Beryllium Copper | 22 | 0.4 in | DIP | 10.16 mm | 0.62 in | 15.75 mm |