228-7474-55-1902

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3M (TC)

CONN SOCKET SOIC 28POS GOLD

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228-7474-55-1902

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3M (TC)

CONN SOCKET SOIC 28POS GOLD

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Technical Specifications

Parameters and characteristics for this part

Specification	228-7474-55-1902

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	SOIC

228 Series

Part	Termination	Termination Post Length	Termination Post Length	Mounting Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Number of Pins	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Housing Material	Contact Finish - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Resistance	Type	Type	Type	Number of Positions or Pins (Grid)	Features	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type
3M (TC) 228-1277-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M (TC) 228-1277-19-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M (TC) 228-1290-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.07 in	1.78 mm	Gold	1.78 mm	0.07 in	Polysulfone (PSU) Glass Filled	Gold				-55 °C	125 °C
3M (TC) 228-4817-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold				-55 °C	125 °C	15 mOhm	DIP ZIF ZIP	10.16 mm	0.4 in	28	Closed Frame
3M (TC) 228-7474-55-1902	Solder	3.56 mm	0.14 in	Through Hole	1 A			Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0				Gold			Polyethersulfone (PES) Glass Filled	Gold				-55 °C	150 °C		SOIC			28	Closed Frame
3M (TC) 228-5204-01	Solder	3 mm	0.118 in	Through Hole				Beryllium Copper						Beryllium Copper			0.02 in	0.5 mm	Gold			Polyethersulfone (PES)	Gold						25 mOhm	QFN			28		4	7
3M (TC) 228-1290-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.07 in	1.78 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold				-55 °C	125 °C	15 mOhm	DIP ZIF (ZIP)	15.24 mm		28	Closed Frame			0.6 "
3M (TC) 228-1371-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold				-55 °C	125 °C	15 mOhm	DIP ZIF (ZIP)	15.24 mm		28	Closed Frame			0.6 "
3M (TC) 228-4817-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold				-55 °C	125 °C
3M (TC) 228-1277-39-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 53.16
		10	$ 48.78
		30	$ 46.91
		50	$ 45.34
		100	$ 42.84

Description

General part information

228 Series

28 (2 x 14) Pos SOIC Socket Gold Through Hole

Documents

Technical documentation and resources