66AK2G12ABYA100E

Active

Texas Instruments

HIGH PERFORMANCE MULTICORE DSP+ARM - 1X ARM A15 CORES, 1X C66X DSP CORE

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet 66AK2G12 Power Consumption Summary +42

66AK2G12ABYA100E

Active

Texas Instruments

HIGH PERFORMANCE MULTICORE DSP+ARM - 1X ARM A15 CORES, 1X C66X DSP CORE

Deep-Dive with AI

DocumentsDatasheet 66AK2G12 Power Consumption Summary +42

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	66AK2G12ABYA100E

Interface	SPI, QSPI, McASP, MMC/SD, USB, CAN, Ethernet, UART, I2C, McBSP, DMA, EBI/EMI
Mounting Type	Surface Mount
Non-Volatile Memory	External
On-Chip RAM	1 MB
Operating Temperature [custom]	-40 °C, 105 °C
Package / Case	FCBGA, 625-LFBGA
Supplier Device Package	625-FCBGA (21x21)
Type	DSP+ARM®
Voltage - Core [custom]	1 V
Voltage - I/O	3.3 V, 1.8 V

66AK2G12 Series

High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core

Part	Voltage - I/O	Supplier Device Package	Package / Case	On-Chip RAM	Type	Operating Temperature [custom]	Non-Volatile Memory	Interface	Mounting Type	Voltage - Core [custom]	Clock Rate	Operating Temperature [Min]	Operating Temperature [Max]
Texas Instruments 66AK2G12ABYA100E	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®	-40 °C 105 °C	External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	1 V
Texas Instruments 66AK2G12ABYA60ES	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®	-40 °C 105 °C	External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	0.9 V	600 MHz
Texas Instruments 66AK2G12ABYT100	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®		External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	1 V		-40 °C	125 ¯C
Texas Instruments 66AK2G12ABYA60	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®	-40 °C 105 °C	External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	0.9 V	600 MHz
Texas Instruments 66AK2G12ABY100	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®		External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	1 V		0 °C	90 °C
Texas Instruments 66AK2G12ABYA100	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®	-40 °C 105 °C	External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	1 V
Texas Instruments 66AK2G12ABYA60E	1.8 V 3.3 V	625-FCBGA (21x21)	625-LFBGA FCBGA	1 MB	DSP+ARM®	-40 °C 105 °C	External	CAN DMA EBI/EMI Ethernet I2C McASP McBSP MMC/SD QSPI SPI UART USB	Surface Mount	0.9 V	600 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	60	$ 68.43
Texas Instruments	JEDEC TRAY (5+1)	1	$ 70.04
		100	$ 62.26
		250	$ 51.18
		1000	$ 45.78

Description

General part information

66AK2G12 Series

66AK2G1x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-proven Keystone II (KS2) architecture. These devices address applications that require both DSP and Arm performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.

Similar to existing KS2-based SoC devices, the 66AK2G1x enables both the DSP and Arm cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or Arm-centric system designs can be achieved.

The 66AK2G1x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G1x parts satisfy a wide range of industrial requirements.

Documents

Technical documentation and resources

Datasheet

66AK2G12 Power Consumption Summary

Datasheet

Designing professional audio mixers for every scenario

White paper

Designing Embedded Systems for High Reliability With 66AK2Gx (Rev. A)

66AK2G12ABYA100E

Deep-Dive with AI

66AK2G12ABYA100E

Deep-Dive with AI

Technical Specifications

66AK2G12 Series

Pricing

Description

66AK2G12 Series

Documents

Datasheet

66AK2G12 Power Consumption Summary

Designing professional audio mixers for every scenario

Designing Embedded Systems for High Reliability With 66AK2Gx (Rev. A)

C66x CorePac User's Guide (Rev. C)

66AK2G12 Power Consumption Summary

K2G Industrial Communications Engine (K2G ICE)

Using DSPLIB FFT Implementation for Real Input and Without Data Scaling

66AK2Gx Schematic Checklist (Rev. A)

66AK2G12 Power Estimation Tool

Keystone II DDR3 Initialization

Industrial Communication Protocols Supported on Sitara™ Processors (Rev. E)

How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A)

Keystone Error Detection and Correction EDC ECC (Rev. A)

TPS659118 User’s Guide for 66AK2G02 Processor

Getting personal with the 66AK2Gx SoC (Rev. A)

SERDES Link Commissioning on KeyStone I and II Devices

DDR3 Design Requirements for KeyStone Devices (Rev. D)

Hardware Design Guide for KeyStone II Devices

DDR ECC Reference Design to Improve Memory Reliability in 66AK2Gx-Based Systems (Rev. B)

Software and Hardware Design Challenges Due to Dynamic Raw NAND Market

Processor SDK RTOS Audio Benchmark Starter Kit

66AK2Gx Hardware Design Guide (Rev. A)

Voice as the user interface – a new era in speech processing white Paper

C66x DSP Cache User's Guide

High-Speed Interface Layout Guidelines (Rev. J)

TPS65911A User’s Guide for 66AK2G12 Processor (Rev. A)

TI DSP Benchmarking

C66x CPU and Instruction Set Reference Guide

K2G Audio Daughter Card Quick Start Guide

66AK2G1x Multicore DSP+Arm KeyStone II System-on-Chip (SoC) datasheet (Rev. F)

66AK2G1x Errata (Rev. B)

K2G Industrial Communications Engine (ICE) Quick Start Guide

PRU-ICSS Feature Comparison (Rev. G)

K2G General Purpose Evaluation Module (EVMK2G) TRM (Rev. A)

Introduction to TMS320C6000 DSP Optimization

Keystone II DDR3 Debug Guide

66AK2Gx BGA Escape Routing Stackup (Rev. A)

66AK2G1x: EVMK2GX General-Purpose EVM Power Distribution Network Analysis

Multicore SoCs stay a step ahead of SoC FPGAs

PRU Assembly Instruction User Guide

66AK2Gx Multicore DSP + ARM Keystone II System-on-Chip (SOC) TRM (Rev. I)

K2G General-Purpose (GP) EVM Quick Start Guide (Rev. A)

KeyStone II DDR3 interface bring-up