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66AK2G12ABYA60ES

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Texas Instruments

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66AK2G12ABYA60ES

Active
Texas Instruments

PROTOTYPE

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification66AK2G12ABYA60ES
Clock Rate600 MHz
InterfaceSPI, QSPI, McASP, MMC/SD, USB, CAN, Ethernet, UART, I2C, McBSP, DMA, EBI/EMI
Mounting TypeSurface Mount
Non-Volatile MemoryExternal
On-Chip RAM1 MB
Operating Temperature [custom]-40 °C, 105 °C
Package / CaseFCBGA, 625-LFBGA
Supplier Device Package625-FCBGA (21x21)
TypeDSP+ARM®
Voltage - Core [custom]0.9 V
Voltage - I/O3.3 V, 1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

66AK2G12 Series

66AK2G1x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-proven Keystone II (KS2) architecture. These devices address applications that require both DSP and Arm performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.

Similar to existing KS2-based SoC devices, the 66AK2G1x enables both the DSP and Arm cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or Arm-centric system designs can be achieved.

The 66AK2G1x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G1x parts satisfy a wide range of industrial requirements.

Documents

Technical documentation and resources