ZSSC3218BI1D ES

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Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

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Active

Renesas Electronics Corporation

DICE (WAFER SAWN) - WAFFLE PACK

Technical Specifications

Parameters and characteristics for this part

Specification	ZSSC3218BI1D ES

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Part	Interface	Applications	Supplier Device Package	Mounting Type	Voltage - Supply [Max]	Voltage - Supply [Min]	Package / Case	Function	Contents	Utilized IC / Part	Supplied Contents	Type
Renesas Electronics Corporation ZSSC3218BI1D ES
Renesas Electronics Corporation ZSSC3218BI3R	I2C SPI	Sensor Signal Conditioner - Resistive	24-QFN (4x4)	Surface Mount	3.6 V	1.68 V	24-VFQFN Exposed Pad
Renesas Electronics Corporation ZSSC3218KITV1P0								Sensor Signal Conditioner	Board(s)	ZSSC3218	Board(s)	Interface

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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General part information

DICE (WAFER SAWN) - WAFFLE PACK

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