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DICE (WAFER SAWN) - WAFFLE PACK
| Part | Interface | Applications | Supplier Device Package | Mounting Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Package / Case | Function | Contents | Utilized IC / Part | Supplied Contents | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics Corporation | ||||||||||||
Renesas Electronics Corporation | I2C SPI | Sensor Signal Conditioner - Resistive | 24-QFN (4x4) | Surface Mount | 3.6 V | 1.68 V | 24-VFQFN Exposed Pad | |||||
Renesas Electronics Corporation | Sensor Signal Conditioner | Board(s) | ZSSC3218 | Board(s) | Interface |