609-50AB
ActiveWakefield-Vette
HEATSINK FOR .063" PCB
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DocumentsThermal Management for BGAs
609-50AB
ActiveWakefield-Vette
HEATSINK FOR .063" PCB
Deep-Dive with AI
DocumentsThermal Management for BGAs
Technical Specifications
Parameters and characteristics for this part
| Specification | 609-50AB |
|---|---|
| Attachment Method | Clip, Thermal Material |
| Fin Height [z] | 12.7 mm |
| Fin Height [z] | 0.5 in |
| Length [x] | 2.895 " |
| Length [x] | 73.53 mm |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC, BGA, LGA, CPU |
| Shape | Rectangular, Pin Fins |
| Thermal Resistance @ Forced Air Flow | 2.5 °C/W, 250 LFM |
| Type | Top Mount |
| Width [x] | 2 in |
| Width [x] | 50.8 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
609-50 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources