HEATSINK FOR .063" PCB
| Part | Material | Width [x] | Width [x] | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | Attachment Method | Fin Height [z] | Fin Height [z] | Shape | Length [x] | Length [x] | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | Aluminum | 2 in | 50.8 mm | ASIC BGA CPU LGA | 2.5 °C/W 250 LFM | Black Anodized | Clip Thermal Material | 12.7 mm | 0.5 in | Rectangular Pin Fins | 2.895 " | 73.53 mm | Top Mount |